Be practical and pursue excellence
Home to a professional ceramic-metal bonding lab, led by a PhD-led R&D team, driving innovation with an investment in R&D exceeding 50%.
Core Capabilities
Advanced Ceramic Material Systems
Specializing in Al₂O₃, AlN, and Si₃N₄ with mastery of high thermal conductivity, high electrical insulation, and high-strength fabrication technologies.
AMB/DBC Core Processes
Active metal brazing and direct copper cladding for high-strength, high-reliability bonding
One-Stop Substrate Solution
For SiC/GaN, IGBT, and new energy vehicle power control applications
Empower high-end manufacturing
High-performance ceramic substrate solutions for semiconductors, new energy vehicles, AI computing power, industrial applications, and aerospace.
Semiconductor
- Power Module Package Substrate
- High-Power LED Heat Dissipation
- Microwave RF Components
New Energy Vehicle
- Main Inverter
- On-Board Charger
- DC-DC Converter Using Copper-Clad Ceramic Substrates
AI and Energy Storage
- AI Compute Chip Thermal Management
- Energy Storage Converter
- BMS System Power Module
Industrial & Aerospace
- High-Frequency Switching Power Supply
- Laser Devices
- Aerospace Electronics
Professional Laboratories & R&D Achievements
Achieved multiple technical breakthroughs in ceramic-metal bonding through advanced experimental equipment and a team of senior experts.
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Whether you need technical consultation or a custom solution, our expert team is here to provide professional support.
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