Empower high-end manufacturing
High-performance ceramic substrate solutions for semiconductors, new energy vehicles, AI computing power, industrial applications, and aerospace.
Semiconductor
Industry Pain Points
- •Power module packaging requires high thermal dissipation efficiency.
- •High-frequency applications demand rigorous insulation performance.
- •Miniaturization trends challenge substrate thickness requirements.
Solutions
- ✓High-thermal-conductivity AlN ceramic substrate with 40% lower thermal resistance
- ✓Ultra-thin substrate process, thickness down to 0.25mm
- ✓Dual-sided heat dissipation design doubles thermal management efficiency
Featured Products
- Power Module Package Substrate
- High-Power LED Heat Sink Substrate
- Microwave RF Device Substrates
New Energy Vehicle
Industry Pain Points
- •Main inverter power density continues to rise
- •Automotive-grade reliability requirements AEC-Q101
- •Challenges of high-temperature environments on material stability
Solutions
- ✓Si₃N₄ AMB Substrate: 3x Longer Thermal Cycling Life
- ✓Automotive-grade quality system, IATF 16949 certified
- ✓High-temperature material system, operating temperature -55°C~150°C
Featured Products
- Ceramic Substrate for Main Inverter
- OBC Onboard Charger Substrate
- DC-DC Converter Power Module
AI and Energy Storage
Industry Pain Points
- •AI computing chip power consumption exceeds 500W
- •High-efficiency requirements for energy storage PCS
- •BMS System Long-Term Durability Requirements
Solutions
- ✓Ultra-high thermal conductivity interface material, thermal resistance < 0.1 K·cm²/W
- ✓Low-loss ceramic substrate, conversion efficiency > 98%
- ✓High-reliability packaging with a design life of >20 years
Featured Products
- AI Compute Chip Thermal Substrate
- Energy Storage PCS Power Module
- BMS system ceramic substrate
Industrial & Aerospace
Industry Pain Points
- •EMI Suppression Requirements for High-Frequency Switching Power Supplies
- •High-power-density heat dissipation for laser devices
- •Reliability in Extreme Aerospace Environments
Solutions
- ✓Low dielectric constant ceramic with 60% reduction in high-frequency loss
- ✓Microchannel liquid cooling substrate, heat dissipation capacity > 500 W/cm²
- ✓Aerospace-grade screening standards. Zero-defect delivery.
Featured Products
- High-Frequency Switching Power Supply Baseboard
- Laser Device Heat Sink Substrate
- Aerospace Electronic Power Module
Can't find your use case?
We provide customized ceramic substrate solutions, including material selection, structural design, and process optimization tailored to your specific requirements.
Contact us for a custom solution